半導體搬送ROBOT
UTM-R3700F
特 長 Features
■ 水平2.7m、垂直1.6m的大動作範圍，不需走行軸即可對應各種Lay Out圖面。
■ 一台ROBOT可連接4個FOUP，最多可連接8個FOUP。
■ This unit accommodates various device layouts thanks to its range of 2.7 m horizontally and 1.6 m vertically without requiring Y-axis track.
■ A single robot can access from 4 FOUPs to a maximum of 8 FOUPs.
■縮短Take Time並提高設備的生產量
■ Reduces takt time and improves equipment throughput
仕 様 Specifications＊1＊2
■ 水平2.7m、垂直1.6m的大動作範圍，不需走行軸即可對應各種Lay Out圖面。
■ 一台ROBOT可連接4個FOUP，最多可連接8個FOUP。
■ This unit accommodates various device layouts thanks to its range of 2.7 m horizontally and 1.6 m vertically without requiring Y-axis track.
■ A single robot can access from 4 FOUPs to a maximum of 8 FOUPs.
■縮短Take Time並提高設備的生產量
■ Reduces takt time and improves equipment throughput
仕 様 Specifications＊1＊2
| 型號 Model |
UTM-R3700F |
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| ROBOT種類 Robot Type | 6-axis articulated system | ||
| 動作範圍 Operation Range |
X1, X2-axis（前後）（Extension） | 590mm | |
| θ-axis（旋回）（Rotation） | 332° | ||
| Z-axis（昇降）（Elevation） | 310-703.8mm | ||
| Y-axis（左右）（Slide） | ±767.5mm | ||
| A-axis（左右傾斜補正）（Correction of Y-axis tilt） | ±2° | ||
| 最大動作速度 Max. Operation Speed |
X1, X2-axis | 1600mm/sec. | |
| θ-axis | 540°/sec. | ||
| Z-axis | 1500mm/sec. | ||
| Y-axis | 1500mm/sec. | ||
| 動作時間 Cycle Time |
X1, X2-axis | 0.9sec./590mm | |
| θ-axis | 1.0sec./332° | ||
| Z-axis | 0.8sec./703.8mm | ||
| Y-axis | 1.4sec./1535mm | ||
| 位置重複精度 Repeatability | XθY directions（composite）: ±0.1mm, Z direction: ±0.1mm | ||
| 可搬重量 Payload | 0.5kg/arm（including Hand, Wafer） | ||
| 潔淨度Cleanliness | 夾持規格Edge Clamp E/E type | ISO Class 3（ISO-14644） | |
| 吸附規格Vacuum E/E type | ISO Class 1（ISO-14644） | ||
| ROBOT本體質量Mass | 74kg | ||
| 必要諸元 Facilities |
夾持規格Edge Clamp E/E type | 正壓Air | 0.3-0.7MpaG |
| 吸附規格Vacuum E/E type | 真空Vacuum | -80kPaG or less, 10NL/min. | |
| 真空（機内排気用） Vacuum（for purging) | -80kPaG or less, 40NL/min total | ||
| 設置環境 Environment |
温度 Temperature | 0-40℃ | |
| 濕度 Humidity | 20-70%, No condensation | ||
| 對應控制器Controller | CFD ▶ P.17 |
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＊1. Transfer performance differs from the standard when options are added. ＊2. Wafer sensor and Mapping sensor are available
